Chip loading transport box chiplets packaging box Self-absorbing plastic box
Chip boxes (IC chip storage boxes) are specialized vehicles for the secure storage, transportation and automated sorting of semiconductor chips (dies) or packaged IC devices, typically made of antistatic engineering plastics (such as PC, ABS, PPS) or conductive composites. Its core function is to protect the chip from mechanical damage, electrostatic discharge (ESD) and environmental pollution, and it is widely used in packaging and testing (OSAT), chip Sorting, SMT and terminal electronic product assembly.
Technical specifications
Chip packaging box /IC storage box is a key auxiliary material to ensure the high yield and high reliability of semiconductor devices. ZMSH provides customized storage and transportation solutions for packaging factories, SMT manufacturers and end customers through precision design and clean manufacturing.
| Materials: | PC, ABS, PPS |
| Surface resistance: | 10⁴~10⁹Ω |
| Particle control: | <0.3μm |
| Transport vibration: | <1G@5-500Hz |
| Function: | Protect the chip from mechanical damage |
| Application: | Package test, chip sorting |
Characteristic of Chip loading transport box
1. Anti-static protection:
- Surface resistance 10⁴~10⁹Ω (in accordance with ANSI/ESD S20.20) to avoid electrostatic damage to the sensitive chip.
** conductive (<10⁴Ω) or dissipative (10⁶~10⁹Ω) ** materials are available.
2. High clean design:
- Low Outgassing material that prevents organic contaminants from adsorbing to the chip surface.
- Particle control <0.3μm to meet Class 1000 clean room requirements.
3. Precision structure adaptation:
- Support QFN, BGA, CSP, SOT and other packaging forms of customized cavity design.
- Shockproof cushioning structures (e.g. elastic silicone gaskets), transport vibration <1G@5-500Hz.
4. Automation compatibility:
- Standardised sizes (such as JEDEC standard trays) for Pick & Place equipment.
- Optional RFID/ barcode tags for chip batch traceability.
Application of Chip loading transport box
(1) Package Testing (OSAT)
Die Sorting: carry the Bare Die after cutting, cooperate with the sorting machine (Handler) for testing and sorting.
Pre-taping & Reeling: to avoid chip contamination or collision damage prior to packaging.
(2) SMT placement and assembly
SMT production line feed: As an alternative to IC carrier belts (TRAYS), suitable for small batch, multi-variety production.
High value chip storage: ESD temporary storage for cpus, Gpus, and memory chips.
(3) Manufacturing of terminal electronic products
Mobile/automotive electronics modules: Protect sensitive devices such as radio frequency chips (RF ics) and sensors (MEMS).
Military and aerospace: Meet high reliability storage requirements (such as -55 ° C to 125 ° C temperature cycle).
(4) Special scenarios
Optoelectronic devices: such as laser diode (LD), VCSEL chip dust storage.
Medical electronics: aseptic packaging solutions for biosensor chips.
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